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| HD74HC640/HD74HC643 Octal Bus Transceivers (with 3-state outputs) Description Each device has an active enable G and a direction control input, DIR. when DIR is high, data flows from the A inputs to the B outputs. When DIR is low, data flows from the B inputs to the A outputs. The HD74HC640 transfers inverted data from one bus to other and the HD74HC643 transfers inverted data from the A bus to the B bus and true data from the B bus to the A bus. Features * * * * * High Speed Operation: tpd = 12 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) Function Table Control Inputs G L L H DIR L H X Operation HD74HC640 B data to A bus A data to B bus Isolation HD74HC643 B data to A bus A data to B bus Isolation HD74HC640/HD74HC643 Pin Arrangement HD74HC640 DIR A1 A2 A3 A4 A5 A6 A7 A8 1 2 3 4 5 6 7 8 9 20 VCC 19 Enable G 18 B1 17 B2 16 B3 15 B4 14 B5 13 B6 12 B7 11 B8 GND 10 (Top View) 2 HD74HC640/HD74HC643 HD74HC643 DIR A1 A2 A3 A4 A5 A6 A7 A8 1 2 3 4 5 6 7 8 9 20 VCC 19 Enable G 18 B1 17 B2 16 B3 15 B4 14 B5 13 B6 12 B7 11 B8 GND 10 (Top View) Absolute Maximum Ratings Item Supply voltage range Input voltage Output voltage Output current DC current drain per VCC , GND DC input diode current DC output diode current Power Dissipation per package Storage temperature Symbol VCC VIN VOUT I OUT I CC, I GND I IK I OK PT Tstg Rating -0.5 to +7.0 -0.5 to VCC + 0.5 -0.5 to VCC + 0.5 35 75 20 20 500 -65 to +150 Unit V V V mA mA mA mA mW C 3 HD74HC640/HD74HC643 Block Diagram HD74HC640 G DIR VCC A B VCC To 7 Other Inverters To 7 Other Inverters 4 HD74HC640/HD74HC643 HD74HC643 G DIR VCC A B VCC To 7 Other Inverters To 7 Other Inverters 5 HD74HC640/HD74HC643 DC Characteristics Ta = 25C Item Input voltage Symbol VIH Ta = -40 to +85C Max -- -- -- 0.3 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 5.0 1.0 40 A A A I OL = 6 mA I OL = 7.8 mA Vin = VIH or VIL, Vout = VCC or GND Vin = VCC or GND Vin = VCC or GND, Iout = 0 A V I OH = -6 mA I OH = -7.8 mA Vin = VIH or VIL I OL = 20 A V Vin = VIH or VIL I OH = -20 A V Unit V Test Conditions VCC (V) Min Typ Max Min 2.0 4.5 6.0 1.5 -- 3.15 -- 4.2 -- -- -- -- -- -- -- -- -- -- 0.3 1.5 3.15 4.2 -- VIL 2.0 4.5 6.0 1.35 -- 1.8 -- 1.9 4.4 5.9 4.13 5.63 -- -- -- Output voltage VOH 2.0 4.5 6.0 4.5 6.0 1.9 2.0 -- 4.4 4.5 -- 5.9 6.0 -- 4.18 -- 5.68 -- -- -- -- -- -- -- -- -- -- -- VOL 2.0 4.5 6.0 4.5 6.0 0.0 0.1 0.0 0.1 0.0 0.1 -- -- -- -- -- 0.26 -- 0.26 -- 0.5 -- 0.1 -- 4.0 -- Off-state output current Input current Quiescent supply current I OZ Iin I CC 6.0 6.0 6.0 6 HD74HC640/HD74HC643 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = 25C Item Symbol Ta = -40 to +85C Max 115 23 20 290 58 49 270 54 46 75 15 13 10 pF ns ns ns Unit ns Test Conditions VCC (V) Min Typ Max Min 2.0 4.5 6.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 12 -- -- 15 -- -- 17 -- -- 4 -- 5 90 18 15 -- -- -- Propagation delay t PLH time t PHL Output enable time t ZH t ZL 2.0 4.5 6.0 230 -- 46 39 -- -- Output disable time t HZ t LZ 2.0 4.5 6.0 215 -- 43 37 60 12 10 10 -- -- -- -- -- -- Output rise/fall time t TLH t THL 2.0 4.5 6.0 Input capacitance Cin -- 7 Unit: mm 24.50 25.40 Max 20 11 7.00 Max 6.30 1 0.89 1.27 Max 10 1.30 2.54 Min 5.08 Max 7.62 0.51 Min 2.54 0.25 0.48 0.10 0.25 - 0.05 0 - 15 + 0.11 Hitachi Code JEDEC EIAJ Weight (reference value) DP-20N -- Conforms 1.26 g Unit: mm 12.6 13 Max 20 11 1 10 5.5 0.80 Max 2.20 Max *0.22 0.05 0.20 0.04 0.20 7.80 + 0.30 - 1.15 0 - 8 0.70 0.20 1.27 *0.42 0.08 0.40 0.06 0.12 M *Dimension including the plating thickness Base material dimension 0.10 0.10 0.15 Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DA -- Conforms 0.31 g Unit: mm 12.8 13.2 Max 20 11 7.50 1 0.935 Max 10 2.65 Max *0.27 0.05 0.25 0.04 0.25 10.40 + 0.40 - 1.45 0.20 0.10 0 - 8 0.57 0.70 + 0.30 - 1.27 *0.42 0.08 0.40 0.06 0.15 0.12 M Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DB Conforms -- 0.52 g *Dimension including the plating thickness Base material dimension Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. |
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